The subject of “Electronic Composites” is old and new. For
electromagnetic properties (particularly dielectric constraint
and electric conductivity) of electronic composites have been
studied extensively since the time of James Maxwell in 19^{th}
century, while electronic composites are key materials for
microelectronics that include computer packages, actuators,
sensors and microelectromechanical systems (MEMS),
nanoelectromechanical systems (NEMS) and BioMEMS.
The aim of this book is to provide readers with introductory
knowledge of various models that can relate the parameters of
nanoand microstructure of the constituent materials to the
overall properties of the electronic composites. The readers
that the author wishes to reach are graduate students and
engineers who are interested in and/or involved in designing
microelectronic packages, actuators, sensors and MEMS/NEMS/BioMEMS.
For the designing of optimum microand nanostructures of
electronic composites they need to work on modeling on
electronic composites, and proceed processing of the
composites. This book provides a summary of such modeling.
The contents of this book are introductory in early chapters
(13) and more comprehensive in later chapters (48). To help
readers who want to learn in–depth knowledge, the book
provides a long list of references and also detailed
appendices at the end.
The present author (1995) wrote a
paper on “Micromechanics Modeling of Electronic Composites”
and has been teaching “Electronic Composites” as a graduate
course at the University of Washington since 1998, thus the
contents of the book are originated from his lecture notes.
There are no textbooks on electronic composites presumably due
to that electronic composites are strongly interdisciplinary,
covering a wide variety of subjects. The author was motivated
to edit his lecture notes into this monograph book by
including more recent subjects related to electronic
composites.
The following is a brief statement
of chapters 18. Chapter 1 introduces definition of
electronic composites and early study on them covering the 19^{th}
and 20^{th} centuries. Chapter 2 discusses various
types of electronic composites that are used in current
applications, electronic packaging and MEMS, BioMEMS, sensors
and actuators, and also control of electromagnetic waves. In
chapter 3, the foundation of the basic equations that govern
the physical behavior of electronic composites, ranging from
thermomechanical to electromagnetic behavior. Chapter 4 is a
key chapter of the book, discussing in details modeling of
electronic composites based on effective medium theory, which
covers from rudimental theory of law of mixtures all the way
to more rigorous Eshelby’s model on coupled behavior such as
piezoelectricity. Chapters 5 and 6 discuss resistor network
model and percolation model, respectively, which are effective
for the cases that cannot be modeled by the effective medium
theory, providing a nanostructure/macrobehavior relation of
electronic composites. Chapter 7 discusses lamination model,
which is simple but effective in estimating the overall
behavior of electronic composites with laminated
microstructure associated often with a number of modern
microelectronics. Chapter 7 includes design of piezoelectric
actuators for bending mode, thermal stress analysis in a thin
film on a substrate and electromagnetic wave propagation in
laminated composites with two examples, switchable window and
surface plasmon resonance. In the final chapter (8)
discussion is made on selective engineering problems,
processing of electronic composites as readers may want to be
familiar with the current processing route, ranging from
lithography to deposition of organic films, followed by
standard measurements of key thermophysical properties and
electronmigration.
In all chapters, both index with
subscripts and symbolic notations are used. The former is
sometimes needed for readers to grasp exact relations in the
governing equations while the latter provides readers with
simple expression, yet leading to matrix formulation, most
convenient form for numerical calculations.
