The University of Washington Microfabrication Facility is open to academic and industry product developers.

Wafer Materials & Sizes

Our cleanroom processes primarily silicon substrates, although we also have experience with silicon on sapphire, quartz, compound semiconductors and other less common materials. The wafer size for which we have the most equipment is 4", but we also process wafers from 3" to 8". Wafer thickness vary from 200 micron to 1 mm substrates. Some clients utilize other materials such as piezoelectrics, polymers, and photonic materials.

Cleanroom Class

Lab cleanroom is Class 10,000.

Processes

The UW MFF provides a wide range of microprocessing capabilities, including:

• Patterning, by contact photolithography and electron beam lithography
• Etching, using either a wide range of wet chemical etchants, or many dry etching systems, including Fluorine RIE, both Fluorine and Chlorine ICP, and Bosch deep silicon etching.
• Physical Vapor Deposition, including electron beam evaporation and sputter deposition
• Chemical Vapor Deposition, including PECVD of silicon oxides and nitrides, LPCVD nitrides and oxides
• Annealing and curing, including both tube furnaces and rapid thermal annealing
• Inspection including optical and electron microscopes
• Thin Film Metrology including film thickness, step height, and resistivity

See our full equipment list, or contact the lab staff to discuss available equipment and processing.