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The University of Washington Microfabrication Facility is open to academic and industry product developers.
Wafer Materials & Sizes
Our cleanroom processes primarily silicon substrates, although we also have experience with silicon on sapphire, quartz, compound semiconductors and other less common materials. The wafer size for which we have the most equipment is 4", but we also process wafers from 3" to 8". Wafer thickness vary from 200 micron to 1 mm substrates. Some clients utilize other materials such as piezoelectrics, polymers, and photonic materials.
Lab cleanroom is Class 10,000.
The UW MFF provides a wide range of microprocessing capabilities, including:
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