 |
| |
 |
NTUF Research Tool Inventory
OpAL – Open Load Atomic Layer Deposition Tool with Combined Thermal/Plasma
The OpAl system is based on Oxford Instruments' Plasmalab 80Plus open-loading process tool platform, and can handle from small wafer pieces up to full 200 mm (8") wafers. ALD offers the opportunity to create precisely controlled structures for advanced semiconductor and other nanotechnology applications, by creating ultra-thin films on nanometer scales. A unique property of ALD is its ability to deposit material conformably around high aspect ratio features.
The addition of combined thermal/plasma modes allows for the widest possible choice of precursor chemistry with enhanced film quality; and accessibility of low-temperature processes for delicate samples. Liquid or solid precursors can be heated to 200 degrees C and bubbled with argon, and are housed inside an extracted stainless steel cabinet providing safe management of hazardous precursors, located within the tool to minimize delivery line length.
Developed processes (with suitable precursors and methods)
Utilizing the same software platform as Oxford Instruments’ trusted Plasmalab product family, the OpAL recipe-driven, multi-user level, PC2000TM control software is easy-to-use and tailored for rapid cycle ALD.
|
|
  |
