Office of Research
2022 Rising Star Faculty Award Program
Contact research@uw.edu for the sponsor's funding opportunity announcement.
Intel’s Rising Star Award (RSA) provides an award of $50,000 and networking support to faculty members who are early in their academic careers and show great promise as future academic leaders. The purpose of this program is to help promote the careers of promising early career faculty members and to foster long term collaborative relationships with Intel.
Who Qualifies?
❖ Any full time, tenured or tenure track (or equivalent) faculty member (including research faculty and / or faculty lecturers);
❖ With 4 years or less cumulative experience as a full-time university faculty (as of Sep ’22);
❖ From universities invited by Intel to participate in this program;
❖ Nominated by appropriate department head (limited to 2 per university);
❖ Has made significant contributions to either Research and/or Education that have the potential to be disruptive to the Semiconductor and Computing Industry in the areas outlined below;
❖ Has not previously been an RSA award recipient; and
❖ Has not been previously employed by Intel for longer than 2 years (excluding internships).
What Areas of Research / Education is Intel Interested In for this Award?
➢ Innovative and disruptive ideas in computer science, electrical engineering, computer engineering, material science, and chemical engineering which have potential to significantly advance semiconductor technologies and the future of computing. Below are key topics of interest, however not exclusive :
➢ Architecture : CPU microarchitecture features for general-purpose IPC (Instructions per Cycle); Advanced hardware-optimizers for CPU performance and power efficiency; Platform architecture; Domain-specific accelerators; New memory technologies in the scope of architecture systems optimization; Neuromorphic computing; Quantum computing.
➢ Device : Energy efficient transistors (low voltage, power, and temperature): 2D PMOS, Ferro-Electrics for Energy Efficiency devices, “beyond-CMOS” (e.g., MESO (Magneto-Electric Spin-Orbit) transistor); Novel patterning methods & materials that extend Moore’s Law and/or the next generation of packaging technology.
➢ Process : CAD for future devices, system level gaps, system validation, AMS validation; Fundamental understanding of interactions between EUV photons and new resists systems designed to minimize variation for high resolution, defect-free printing.
➢ Materials & Patterning : Packaging materials and processing; Magnetic materials for high voltage inductors; fast deposition, low stress materials; Functional materials for ultra-fast or high aspect ratio via fill within core.
➢ Software : Software for heterogeneous hardware; Machine Programming; Human Technology Interactions, ambient computing and smart spaces; Unified programming models for distributed computing across Cloud, Edge, and Client including function compute and microservices.
➢ Artificial Intelligence : More capable AI: Enabling machines to exceed human-level performance. Efficient/sustainable AI: Scalable and efficient models and computing architectures; Future of work with AI: Including common sense reasoning, cognition, voice and vision technologies; compiler & runtime research for agile efficient mapping of machine/deep learning; new applications & usages: Evaluating emerging applications and use cases; Ethical AI.
➢ Security : Privacy; Hardware security; Autonomous systems and safety; Confidential computing; Cryptography; Automated tools and methodologies; Adversarial AI; Privacy-preserving AI.
➢ Connectivity : Wireless & networking: Fusion of wireless sensing & communications (passive & active radar, multi-use radios, self-awareness, human-machine interfaces, client & infrastructure); Programmable networks & microservices; Novel electrical interconnects; Photonic devices (modulators/photodetectors); Photonic packaging; Dense wavelength division multiplexing (DWDM) light sources (quantum dot/amplifiers).
➢ Manufacturing : Smart manufacturing/Industry 4.0; Autonomous digital supply chain; Supply chain gaming & planning; Supply chain transformation; Equipment productivity and modeling; Big data analytics for fault detection and yields; Low-cost inspection/metrology for smaller & 3-D package features.
We are particularly interested in candidates who are using innovative methods of teaching as well as those candidates who are on the forefront of increasing the participation of women and underrepresented minorities in computer science and engineering.
Application Instructions
Please submit:
- A nominating letter that addresses the criteria of the award that also documents the candidate’s start date
- Biosketch or CV of the PI
to research@uw.edu by 5:00 PM Wednesday, May 25, 2022. Nominations are due to the sponsor 6/17/2022 if given the go‐ahead by the review committee.
Inquiries and Contact Information
Investigators who identify a grant, award or fellowship program that restricts the number of applications that can be submitted from an Institution should immediately contact their Chairperson, Associate Dean for Research (or Dean, if no ADR) and the Office of Research (see below) if they intend to prepare a response. Failure to do so, or to meet the deadlines for submission of pre-proposal, will preclude submission of the application through the Office of Sponsored Programs.
For general inquiries, or to request a listing of a limited submission opportunity that should be but is not already listed, please email us at limitedsubs@uw.edu.