A central challenge for high-throughput printed electronics is to align multiple layers of different materials with micron-level tolerances on moving web substrates. The precision alignment mechanisms typical of wafer-based semiconductor fabrication facilities are generally not available for web-handling equipment. Moreover, compared to rigid substrates such as glass or silicon, polymeric web substrates undergo considerable deformation during processing, which makes alignment extremely challenging. In this presentation, a self-aligned manufacturing process for printed electronics is introduced. The process involves capillary flow of liquid inks in multi-tiered trenches on a plastic substrate to eventually produce a stack of functional materials. By engineering suitable device cavities, a wide range of discrete electronic components, such as interconnects, resistors, capacitors, and thin film transistors can be built.