This lecture focuses on the challenging design, realization, characterization, and implementation of new materials and processing techniques for creating unconventional electronic circuitry. Fabrication methodologies to achieve these goals include high-throughput, large-area printing techniques combined with low temperature processing. Materials design topics to be discussed include: 1. Rationally designed high-mobility p- and n-type organic semiconductors for printed organic CMOS, 2. Polycrystalline and amorphous oxide semiconductors for transparent and mechanically flexible electronics, 3) Self-assembled and printable high-k nanoscale gate dielectrics for transistors, enabling ultra-large capacitance, low leakage, high breakdown fields, minimal trapped interfacial charge, and device radiation hardness. 4) Combining these materials sets to fabricate a variety of high-performance thin-film transistor-based circuitry. 5) Implications for photovoltaic materials.