NTUF Research Tool Inventory


The XL830 dual beam workstation is a single platform for both hi-resolution electron/ion imaging and site specific milling for a variety of applications. It is equipped with a field-emission SEM column and a gallium focused ion beam (FIB). The electron beam allows observation of samples while the FIB accomplishes nano-machining of samples and devices for device editing, failure analysis, and sublayer observation. Detectors include Through the Lens Detector (TLD) and Continuous Dynode Electron Multiplier (CDEM) for secondary electron, backscattered electron, and secondary ion imaging.

A stationary microprobe is used for extraction of milled TEM lamella samples from wafer substrates. Beam chemistries include enhanced Si/SiOx etch and site specific platinum deposition.

The load lock can accommodate full 8" wafers, wafer fragments, or pin-mount stubs and allows sample transfer time of <2min. Maximum sample height is limited to 10mm. An IR CCD camera is available for low-magnification observation of samples in the vacuum chamber.

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