For those of you who have an interest in printed electronics, I want to let you know that the University of Washington will be hosting a Printed Electronics Summit on Tuesday and Wednesday March 7-8. The event is co-sponsored by the College of Engineering SRI teams focused on “Printed Electronics” and “Additive Manufacturing with Advanced Materials” along with several companies (including Ricoh, TEL, and DNP) that are interested in potential research collaborations.

Devin MacKenzie is the lead technical organizer.

The event will be held in Alder Commons and the Washington Clean Energy Testbed in the Bowman building. The flyer with more information about the event is attached. It is free of charge, but capacity is limited. (Planned capacity is 80, and there are 40 committed international attendees.)

2017 PE Summit Eflyer

If you would like to attend, please register using the RSVP URL below: