• Once all of the parts are on there and in the correct orientation they may be soldered into place at 230C using a standard laboratory hot plate. This work should be performed in a fume hood as gases will emanate off the board as the solder heats up and flux burns off.

(:headnr:) Attach:T_MB_4AB.jpg Δ Δ (:cell:) Step 4. Solder all surface mount parts at 230C.

• Once all of the parts are on there and in the correct orientation they may be soldered into place at 230°C using a standard laboratory hot plate. This work should be performed in a fume hood as gases will emanate off the board as the solder heats up and flux burns off.
• As the board heats the CHIPQUICK solder will go from having a dull grey appearance to shiny and metallic and small wisps of smoke may be visible.
• Once the solder on all parts become shiny and metallic simply use tweezers to slide the curcuit board onto a pot holder or other heat-tolerating substance. Be careful not to disturb the parts on the board as they will require a few seconds to cool.
• Note that once the solder cools it may have a dull finish if lead free solder is used. This is okay. Leaded solder should maintain a shinier finish.

(:headnr:) Attach:T_MB_5A.jpg Δ Δ Attach:T_MB_5B.jpg Δ Δ Attach:T_MB_5C.jpg Δ Δ (:cell:) Step 5. Place and solder the BS107.

• Readjust the leads on each BS107 so that they fit int the main circuit board. The orientation is indicated by the PCB silkscreening.
• Solder each of the BS107 in place.
• Trim the leads off each BS107.

(:headnr:) Attach:T_MB_6A.jpg Δ Δ Attach:T_MB_6B.jpg Δ Δ Attach:T_MB_6C.jpg Δ Δ (:cell:) Step 6. Cut the headers to size and solder to holes closest to the ATMEGA164a.

• Cut or break the headers to the appropriate length.
• Using poster tack or tape to hold headers in place and solder it on the surface mount part side of the main board.
• Solder the headers into the set of 2x5 holes closest to the ATMEGA164a.

(:headnr:) Attach:T_MB_7A.jpg Δ Δ Attach:T_MB_7B.jpg Δ Δ Attach:T_MB_7C.jpg Δ Δ (:cell:) Step 7. Solder on Molex connector and place the rest of headers into all other through-hole locations.

• As before use poster tack or tape to hold through hole parts into place before soldering.
• The molex connector clips into place and can be soldered without poster tack or tape.

(:headnr:) Attach:T_MB_8AB.jpg Δ Δ (:cell:) Step 8. Solder on the RJ45 connectors.

• clip on the RJ45 connectors and solder them.

(:headnr:) Attach:T_MB_Trouble1AB.jpg Δ Δ Attach:T_MB_Trouble1C.jpg Δ Δ (:cell:) Troubleshooting Soldering.

• One common problem, especially when soldering the surface mount parts is that multiple pins may be connected by excess solder.
• To remove excess solder place this region under a piece of copper braid (aka "solder wick") and apply heat until the excess solder has been removed by capillary forces.

(:headnr:) Attach:T_MB_4AB.jpg Δ Δ (:cell:) Step 4. Solder all surface mount parts at 230°C.

• Once all of the parts are on there and in the correct orientation they may be soldered into place at 230°C using a standard laboratory hot plate. This work should be performed in a fume hood as gases will emanate off the board as the solder heats up and flux burns off.
• As the board heats the CHIPQUICK solder will go from having a dull grey appearance to shiny and metallic and small wisps of smoke may be visible.
• Once the solder on all parts become shiny and metallic simply use tweezers to slide the curcuit board onto a pot holder or other heat-tolerating substance. Be careful not to disturb the parts on the board as they will require a few seconds to cool.
• Note that once the solder cools it may have a dull finish if lead free solder is used. This is okay. Leaded solder should maintain a shinier finish.

(:headnr:) Attach:T_MB_2A.jpg Δ Δ Attach:T_MB_2B.jpg Δ Δ Attach:T_MB_2C.jpg Δ Δ (:cell:) Step 2. Apply CHIPQUICK to the Main circuit board.

• To apply CHIPQUICK use the blunt needle adaptor to add a minimal quantity of solder.
• Apply CHIPQUICK to all areas where surface mount parts will be placed.
• Use tweezers to lay the ATMEGA164A onto the OD board and place it such that it so that each pin lays directly over its respective pad.
• Note how the dot on the part matches the dot silk screened onto the circuit board.

(:headnr:) Attach:T_MB_3.jpg Δ Δ (:cell:) Step 3. Apply all surface mount parts in the correct orientation.

• Next add the remainder of the surface mount parts with special attention to orientation of each of the parts. (zooming in on the image may help).

(:table border=1 cellpadding=5 cellspacing=0:) (:head width=650:) Attach:T_MB_1.jpg Δ Δ (:cell:) Step 1. Gather all parts and tools:

Tools

• Main Circuit Board
• tweezers
• CHIPQUICK solder paste (or similar)

Surface Mount Parts

• ATMEGA164a (orientation matters)
• Ceramic oscilator (orientation matters)
• 74HCT151 (296-9254-5-ND) (orientation matters)
• 150ohm resistor network (766-163-R150P-ND)
• 4x 1.0uF ceramic capacitors
• 1kohm resistor 0805
• 5x 10kohm resistors 0805
• button
• LED (orientation matters)

Through-hole Parts

• RJ45 connector (orientation matters, but it only goes in one way)
• Molex connector (orientation matters, but it only goes in one way)
• screw terminal (orientation matters)
• breakaway 0.1" header strip
• Large electrolytic capacitors (10-1000uF) (orientation matters (or it may explode))
• BS107 (orientation matters)

(:title Main Board:)

(page under construction)

What we're calling the "main circuit board" is principally responsible for taking in turbidity measurements taken many times a minute and using those to determine the dilution rate for each chamber on a minute by minute basis. Additionally it connects to your Mac/PC to output all data and accept commands.

It should be noted that this main board connects to a 12V/x amp power source which can be dangerous. As such this part should be encased in a non-conductive material and particular care should be taken when working with and attaching wires to the leads. Further safety instructions are included in the Final Assembly section.

(:table border=1 cellpadding=5 cellspacing=0:) (:head width=650:) Attach:T_MB_1.jpg Δ Δ (:cell:) Step 1. Gather all parts and tools:

Tools

• Main Circuit Board
• tweezers
• CHIPQUICK solder paste (or similar)

Surface Mount Parts

• ATMEGA164a (orientation matters)
• Ceramic oscilator (orientation matters)
• 74HCT151 (296-9254-5-ND) (orientation matters)
• 150ohm resistor network (766-163-R150P-ND)
• 4x 1.0uF ceramic capacitors
• 1kohm resistor 0805
• 5x 10kohm resistors 0805
• button
• LED (orientation matters)

Through-hole Parts

• RJ45 connector (orientation matters, but it only goes in one way)
• Molex connector (orientation matters, but it only goes in one way)
• screw terminal (orientation matters)
• breakaway 0.1" header strip
• Large electrolytic capacitors (10-1000uF) (orientation matters (or it may explode))
• BS107 (orientation matters)

(:headnr:) Attach:T_MB_2A.jpg Δ Δ Attach:T_MB_2B.jpg Δ Δ Attach:T_MB_2C.jpg Δ Δ (:cell:) Step 2. Apply CHIPQUICK to the Main circuit board.

• To apply CHIPQUICK use the blunt needle adaptor to add a minimal quantity of solder.
• Apply CHIPQUICK to all areas where surface mount parts will be placed.
• Use tweezers to lay the ATMEGA164A onto the OD board and place it such that it so that each pin lays directly over its respective pad.
• Note how the dot on the part matches the dot silk screened onto the circuit board.

(:headnr:) Attach:T_MB_3.jpg Δ Δ (:cell:) Step 3. Apply all surface mount parts in the correct orientation.

• Next add the remainder of the surface mount parts with special attention to orientation of each of the parts. (zooming in on the image may help).

(:headnr:) Attach:T_MB_4AB.jpg Δ Δ (:cell:) Step 4. Solder all surface mount parts at 230°C.

• Once all of the parts are on there and in the correct orientation they may be soldered into place at 230°C using a standard laboratory hot plate. This work should be performed in a fume hood as gases will emanate off the board as the solder heats up and flux burns off.
• As the board heats the CHIPQUICK solder will go from having a dull grey appearance to shiny and metallic and small wisps of smoke may be visible.
• Once the solder on all parts become shiny and metallic simply use tweezers to slide the curcuit board onto a pot holder or other heat-tolerating substance. Be careful not to disturb the parts on the board as they will require a few seconds to cool.
• Note that once the solder cools it may have a dull finish if lead free solder is used. This is okay. Leaded solder should maintain a shinier finish.

(:headnr:) Attach:T_MB_5A.jpg Δ Δ Attach:T_MB_5B.jpg Δ Δ Attach:T_MB_5C.jpg Δ Δ (:cell:) Step 5. Place and solder the BS107.

• Readjust the leads on each BS107 so that they fit int the main circuit board. The orientation is indicated by the PCB silkscreening.
• Solder each of the BS107 in place.
• Trim the leads off each BS107.

(:headnr:) Attach:T_MB_6A.jpg Δ Δ Attach:T_MB_6B.jpg Δ Δ Attach:T_MB_6C.jpg Δ Δ (:cell:) Step 6. Cut the headers to size and solder to holes closest to the ATMEGA164a.

• Cut or break the headers to the appropriate length.
• Using poster tack or tape to hold headers in place and solder it on the surface mount part side of the main board.
• Solder the headers into the set of 2x5 holes closest to the ATMEGA164a.

(:headnr:) Attach:T_MB_7A.jpg Δ Δ Attach:T_MB_7B.jpg Δ Δ Attach:T_MB_7C.jpg Δ Δ (:cell:) Step 7. Solder on Molex connector and place the rest of headers into all other through-hole locations.

• As before use poster tack or tape to hold through hole parts into place before soldering.
• The molex connector clips into place and can be soldered without poster tack or tape.

(:headnr:) Attach:T_MB_8AB.jpg Δ Δ (:cell:) Step 8. Solder on the RJ45 connectors.

• clip on the RJ45 connectors and solder them.

(:headnr:) Attach:T_MB_Trouble1AB.jpg Δ Δ Attach:T_MB_Trouble1C.jpg Δ Δ (:cell:) Troubleshooting Soldering.

• One common problem, especially when soldering the surface mount parts is that multiple pins may be connected by excess solder.
• To remove excess solder place this region under a piece of copper braid (aka "solder wick") and apply heat until the excess solder has been removed by capillary forces.

test

(:headnr:) Attach:T_MB_Trouble1AB.jpg Δ Δ Attach:T_MB_Trouble1C.jpg Δ Δ

(:headnr:) Attach:T_MB_7A.jpg Δ Δ Attach:T_MB_7B.jpg Δ Δ Attach:T_MB_7C.jpg Δ Δ

(:headnr:) Attach:T_MB_2A.jpg Δ Δ Attach:T_MB_2B.jpg Δ Δ Attach:T_MB_2C.jpg Δ Δ

(:headnr:) Attach:T_MB_6A.jpg Δ Δ Attach:T_MB_6B.jpg Δ Δ Attach:T_MB_6C.jpg Δ Δ

Surface Mount Parts

• Note how the dot on the part matches the dot silk screened onto the circuit board.

• One common problem, especially when soldering the surface mount parts is that multiple pins may be connected by excess solder.
• To remove excess solder place this region under a piece of copper braid (aka "solder wick") and apply heat until the excess solder has been removed by capillary forces.

• The molex connector clips into place and can be soldered without poster tack or tape.

(:cell:) Step 8. Solder on the RJ45 connectors.

• clip on the RJ45 connectors and solder them.

(:cell:) Step 7. Solder on Molex connector and place the rest of headers into all other through-hole locations.

• As before use poster tack or tape to hold through hole parts into place before soldering.
• The RJ45 connectors clip into place and can be soldered without poster tack or tape.

• breakaway 0.1" header strip

(:cell:) Step 6. Cut the headers to size and solder to holes closest to the ATMEGA164a.

• Cut or break the headers to the appropriate length.
• Using poster tack or tape to hold headers in place and solder it on the surface mount part side of the main board.
• Solder the headers into the set of 2x5 holes closest to the ATMEGA164a.

(:cell:) Step 5. Place and solder the BS107.

• Readjust the leads on each BS107 so that they fit int the main circuit board. The orientation is indicated by the PCB silkscreening.
• Solder each of the BS107 in place.
• Trim the leads off each BS107.

• CHIPQUICK solder paste (or similar)

• ATMEGA164a (orientation matters)
• Ceramic oscilator (orientation matters)
• 74HCT151 (296-9254-5-ND) (orientation matters)

• button
• LED (orientation matters)

• RJ45 connector (orientation matters, but it only goes in one way)
• Molex connector (orientation matters, but it only goes in one way)
• screw terminal (orientation matters)
• 0.1" header strip
• Large electrolytic capacitors (10-1000uF) (orientation matters (or it may explode))
• BS107 (orientation matters)

• 150ohm resistor network (766-163-R150P-ND)
• 4x 1.0uF ceramic capacitors
• 1kohm resistor 0805
• 5x 10kohm resistors 0805
• button
• LED

• ATMEGA164a
• Ceramic oscilator
• 74HCT151 (296-9254-5-ND)

(:cell:) Step 4. Solder all surface mount parts at 230°C.

• Once all of the parts are on there and in the correct orientation they may be soldered into place at 230°C using a standard laboratory hot plate. This work should be performed in a fume hood as gases will emanate off the board as the solder heats up and flux burns off.

• Note that once the solder cools it may have a dull finish if lead free solder is used. This is okay. Leaded solder should maintain a shinier finish.

• tweezers

• Use tweezers to lay the ATMEGA164A onto the OD board and place it such that it so that each pin lays directly over its respective pad.

• Next add the remainder of the surface mount parts with special attention to orientation of each of the parts. (zooming in on the image may help).

• Once the solder on all parts become shiny and metallic simply use tweezers to slide the curcuit board onto a pot holder or other heat-tolerating substance. Be careful not to disturb the parts on the board as they will require a few seconds to cool.

(:cell:) Step 6. Solder on the "Through-hole part 3" and Cut the "through-hole part 4" and solder those closest to the ATMEGA164a in place.

What we're calling the "main circuit board" is principally responsible for taking in turbidity measurements taken many times a minute and using those to determine the dilution rate for each chamber on a minute by minute basis. Additionally it connects to your Mac/PC to output all data and accept commands.

It should be noted that this main board connects to a 12V/x amp power source which can be dangerous. As such this part should be encased in a non-conductive material and particular care should be taken when working with and attaching wires to the leads. Further safety instructions are included in the Final Assembly section.

(:cell:) Troubleshooting Soldering.

• One common problem, especially when soldering the layover parts is that multiple pins on a given part may be connected by excess solder.
• To remove excess solder place this region under a piece of "solder wicking wire"

(:cell:) Step 8. Solder on the LAN connection ports.

• clip on the "LAN connection ports and solder them.

(:cell:) Step 5. Place and solder the "through-hole part6".

• Readjust the "prongs" on each "TH Part6" so that they fit int the main circuit board.
• Solder each of the"TH Part6's" in place.
• Trim the "prongs" off each "TH Part6".

(:cell:) Step 6. Solder on the "Through-hole part 3" and Cut the "through-hole part 4" and solder those closest to the "ATG Mother Brain" in place.

• Using putty or tape to hold "through-hole part 3" in place and solder it on the layover part side of the main board.
• When cutting the "TH part4 do not cut too close to the metal "prongs".
• Solder the first set of "5-pronged" "layover part 4" into the set of 2x5 holes closest to the "ATG motherbrain"

(:cell:) Step 7. Solder on "through-hole part 2" and place the rest of "Through-hole part 4" into all other through-hole locations.1

• As before use putty or tape to hold throughhole part 4 into place before soldering.
• "Through-hole part 2" clips into place and can be soldered without putty or tape.

(:cell:) Step 2. Apply CHIPQUICK to the Main circuit board.

• To apply CHIPQUICK use the blunt needle adaptor to add a minimal quantity of solder.
• Apply CHIPQUICK to all areas where layover parts will be placed.
• Use forceps to lay the "ATG mother brain" onto the Main circuit board and place it such that it lays directly over the "metal pads".

(:cell:) Step 3. Apply all layover parts in the correct orientation.

• Next add the remainder of the layover parts with special attention to orientation of each of the parts. (zooming in on the image may help).

(:cell:) Step 4. Solder all layover parts at 230°C.

• Once all of the parts are on there and in the correct orientation they may be soldered into place at 230°C using a hot plate intended for such temperatures. This work should be performed in a fume hood as gases will emanate off the board as the solder heats up.
• As the board heats the CHIPQUICK solder will go from having a dull grey appearance to shiny and metallic and small wisps of smoke may be visible.
• Once the solder on all parts become shiny and metallic simply use forceps to slide the curcuit board onto a pot holder or other heat-tolerating substance. Be careful not to disturb the parts on the board as they will require a few seconds to cool.

(:cell:) Step 2. Stuff:

(:cell:) Step 3. Stuff

(:cell:) Step 4. Stuff

(:cell:) Step 5. Stuff:

(:cell:) Step 6. Stuff

(:cell:) Step 7. Stuff

(:cell:) Step 8. Stuff

(:cell:) Trouble shooting soldering. Trouble happens

(:head width=550:) Attach:T_MB_3.jpg Δ Δ

• Main Circuit Board

Tools

• Forceps
• CHIPQUICK

Layover Parts

• Part 9

Through-hole Parts

• Part 1
• Part 2
• Part 3
• Part 4
• Part 5
• Part 6
• Part 7
• Part 8
• Part 9

(:cell:) Step 1. Gather all parts and tools:

• Part 1
• Part 2
• Part 3
• Part 4
• Part 5
• Part 6
• Part 7
• Part 8

(:head width=550:) Attach:T_MB_Trouble1ABC.jpg Δ Δ

(:head width=550:) Attach:T_trouble1ABC.jpg Δ Δ

(:head width=550:) Attach:T_MB_4AB.jpg Δ Δ

(:head width=550:) Attach:T_MB_8AB.jpg Δ Δ

(:head width=550:) Attach:T_MB_1.jpg Δ Δ

2 (:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_2ABC.jpg Δ Δ (:cell:) Step 1. Gather all 3d printed parts:

• stuff

3 (:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_3ABC.jpg Δ Δ (:cell:) Step 1. Gather all 3d printed parts:

• stuff

4 (:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_4ABC.jpg Δ Δ (:cell:) Step 1. Gather all 3d printed parts:

• stuff

5 (:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_5ABC.jpg Δ Δ (:cell:) Step 1. Gather all 3d printed parts:

• stuff

6 (:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_6ABC.jpg Δ Δ (:cell:) Step 1. Gather all 3d printed parts:

• stuff

7 (:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_7ABC.jpg Δ Δ (:cell:) Step 1. Gather all 3d printed parts:

• stuff

8 (:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_8ABC.jpg Δ Δ (:cell:) Step 1. Gather all 3d printed parts:

• stuff

trouble

(:cell:) Step 1. Gather all 3d printed parts:

• stuff

(:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_2ABC.jpg Δ Δ

(:title Main Board:)

(page under construction) Intro here

(:table border=1 cellpadding=5 cellspacing=0:) (:head width=550:) Attach:T_MB_1.jpg Δ Δ (:cell:) Step 1. Gather all 3d printed parts:

• stuff