||The ion beam sputtering chamber
is customized for growing thin films and multilayers
in an ultra-high vacuum environment. The system
is cryopumped to a base pressure of 3x10-9 torr
and includes a load lock and residual gas analyzer.
Four rotatable targets allow for the deposition
of alloys and multilayers. The chamber is also
flexibly configured to accomodate reactive sputtering
of oxides/nitrides with the ability to introduce
gases (N2, O2 and Ar) under controlled flow rates.
With a special heater, substrate temperature can
be set from room temperature up to 1000ºC to obtain
the desired microstructure and film properties.
A magneto-optic Kerr effect (MOKE) magnetometry
system is under development for this chamber.
Vacuum Furnace (1100°C) and variable atomospheres
(Nitrogen, Oxygen, Argon)
User access to microfabrication laboratory at the
Washington Technology Center for lithography