Manufacturing
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Manufacturing

Manufacturing Related Journals

[1987-1995] [1996-2000] [2001-2004] [2005-Present]

2010

  • Fairweather, J. D.; Cheung, P.; Schwartz, D. T., The effects of  wetproofing on the capillary properties of proton exchange membrane fuel cell gas diffusion layers. Journal of Power Sources 2010, 195 (3), 787-793.
  • Kitayaporn, S.; Hoo, J. H.; Bohringer, K. F.; Baneyx, F.; Schwartz, D.  T., Orchestrated structure evolution: accelerating direct-write  nanomanufacturing by combining top-down patterning with bottom-up  growth. Nanotechnology 2010, 21 (19).
  • Zhou, W.; Schwartz, D. T.; Baneyx, F., Single-Pot Biofabrication of Zinc Sulfide Immuno-Quantum Dots. Journal of the American Chemical Society2010, 132 (13), 4731-4738.

2009  [Top]

  • Grosh, C. D.; Schwartz, D. T.; Baneyx, F., Protein-Based Control of Silver Growth Habit Using Electrochemical Deposition. Crystal Growth & Design 2009, 9 (10), 4401-4406.
  • P. Cheung, J.D. Fairweather, and D.T. Schwartz, Characterization of internal wetting in polymer electrolyte membrane gas diffusion layers, Journal of Power Sources  187 487-492 (2009).

2008  [Top]

  • A. Sengupta, C.K. Thai, M.S.R Sastry, J.F. Matthaei, D.T. Schwartz, E.J Davis, and F. Baneyx, A genetic approach for controlling the binding and orientation of proteins on nanoparticles, Langmuir 24 2000-2008 (2008)
  • D.B. Allred, A. Cheng, M. Sarikaya, F. Baneyx, and D.T. Schwartz, Three-dimensional architecture of inorganic nanoarrays electrodeposited through a surface-layer protein mask, Nano Letters 8 1434-1438 (2008)
  • J.B. Nelson and D.T. Schwartz, Characterization of buffered electrolytes for nickel electrochemical printing, J. of the electrochemical society 155 D181-D186 (2008)

2007  [Top]

  • D.B. Allred, M. Sarikaya, F. Baneyx, and D.T. Schwartz, Bacterial surface-layers for electrochemical nanofbrication, Electrochim Acta 53 193-199 (2007).
  • J.B. Nelson and D.T. Schwartz, Electrochemical factors controlling the patterning of metals on SAM-coated substrates, Langmuir 23 9661-9666 (2007).
  • F. Baneyx and D.T. Schwartz, The peptide-inorganic interface, Curr. Opin. Biotech. 18 312-317 (2007).
  • J.B. Nelson and D.T. Schwartz, Electrochemical Printing: Mass transfer effects, J. Micromech. Microeng. 17, 1192-1199 (2007).
  • A. Presenda, D.B. Allred F. Baneyx, D.T. Schwartz, M. Sarikaya, Stability of s-layer proteins for electrochemical nanofabrication, Coll Surf B 57 256-261(2007).
  • D.B. Allred, M. Zin, H. Ma, M. Sarikaya, F. Baneyx A.K-y. Jen, and D.T. Schwartz, Direct nanofabrication and TEM characterization on a suite of utrathin film substrates, Thin Sol. Films 515 5341–5347 (2007).

2006  [Top]    

  • D.T. Schwartz, Electrodeposition and Nanobiosystems, Interface Mag. 15(1), 34-35 (2006).

2005 [Top]  

  • J.B. Nelson and D.T. Schwartz, "Electrochemical Printing: in situ characterization using an electrochemical quartz crystal microbalance," J. Micromech Microeng, 15  2479-84 (2005). See also the journal cover image
  • H. Dai, W-S. Choe, C.K. Thai, M. Sarikaya, B. A. Traxler, F. Baneyx, and D.T. Schwartz, Nonequilibrium synthesis and organization of hybrid protein-inorganic nanostructures, J.A.C.S. 127, 15637-43 (2005).
  • J.D. Whitaker, J.B. Nelson, and D.T. Schwartz, "Electrochemical Printing: Software reconfigurable electrochemical microfabrication," J. Micromech Microeng, 15, 498-503 (2005). See also the journal cover image
  • J.R. Wilson, S.B. Adler, and D.T. Schwartz, Full spectrum nonlinear response of a harmonically oscillated rotating disk electrode, Phys. Fluids 17 063601 (2005).
  • D.B. Allred, M. Sarikaya, F. Baneyx, and D.T. Schwartz, Electrochemical Nanofabrication using crystalline protein masks, Nano Lett. 5, 609-613 (2005). See also the journal cover image

2004 [Top]          

  • H. Dai, C.K. Thai, M. Sarikaya, F. Baneyx, and D.T. Schwartz, Through-mask anodic patterning of copper surfaces and film stability in biological media, Langmuir 20, 3483-6 (2004). See also the journal cover image
  • C.K. Thai, H. Dai, M.S.R. Sastry, M. Sarikaya, D.T. Schwartz, and F. Baneyx, Identification and characterization of Cu2O- and ZnO- binding polypeptides by Escherichia coli cell surface display: Toward an understanding of metal oxide binding, Biotech Bioeng 87, 129-37 (2004).
  • M. Sarikaya, C. Tamerler, D.T. Schwartz, F. Baneyx, Material assembly and formation using engineered polypeptides, Ann. Rev. Mat. Res. 34, 373-408 (2004).

2003  [Top]            

  • X. Xiong, et al., Multibatch self-assembly of MEMS by electrochemcial modulation of surface energy, J. MEMS 12, 111-127 (2003).

2002  [Top]             

  • W. Wang,  S.D. Leith, and D.T. Schwartz, Convective-diffusive mass transfer inside complex micromolds during electrodepositon, J. MEMS, 11, 118-124 (2002).

2001  [Top]  

  • W. Wang, M.R Holl, and D.T. Schwartz, Rapid prototyping of masks for through-mask electrodeposition of thick metallic components, J. Electrochem. Soc.148, C363-368 (2001).

2000 [Top]  

  • S.D. Leith and D.T. Schwartz, High throughput electrodeposition of uniform NiFe micromachined components  through thick molds, J. MEMS 8, 384-92 (1999).

1999 [Top]      

  • S.D. Leith and D.T. Schwartz, Through mold electrodeposition using the uniform injection cell: Workpiece and pattern scale uniformity, Electrochim. Acta, 44, 4017-27 (1999).
  • S.D. Leith and D.T. Schwartz, In-situ fabrication of sacrifical layers in electrodeposited NiFe microstructures, J. Micromech Microeng., 9 97-104 (1999). See also the journal cover photograph.
  • S.D. Leith, S. Ramli, and D.T. Schwartz, Characterization of NixFe1–x (0.1≤x≤0.95) electrodeposition from a family of sulfamate-chloride electrolytes, J. Electrochem. Soc. 146 , 1431-35 (1999).

1998  [Top]  

  • S.D. Leith, W. Wang, and D.T. Schwartz, Characterization of flow-induced structure in NiFe CMAs, J. Electrochem. Soc., 145 2827-33 (1998).

1997 [Top]     

  • J.A. Medina and D.T. Schwartz, Electrodeposition of flow-induced composition modulated NiFe alloys in the  uniform injection cell, Electrochim. Acta 42, 2679-2684 (1997).
  • J.A. Medina and D.T. Schwartz, Nonlinear dynamics of limiting current in the flow-modulated uniform injection cell, J. Electrochem. Soc. 144, 155-65 (1997).

1996 [Top]

  • J.A. Medina and D.T. Schwartz, Nonlinear dynamics of modulated flow between a porous injector and an impermeable substrate, Phys. Fluids 8, 2895-2905 (1996).
  • J.A. Medina and D.T. Schwartz, Inertial oscillations in the impulsively-started flow between a porous injector  and an impermeable substrate, Proc. R. Soc. Lond. A, 452, 1885-1902 (1996).
  • S.D. Leith and D.T. Schwartz, Flow-induced composition modulated NiFe thin films with nanometer-scale wavelengths, J. Electrochem. Soc., 143, 873-879 (1996).

1995[Top]  

  • J.A. Medina, D.L. Sexton, and D.T. Schwartz, Steady state characterization of the uniform injection cell: II. Experiment, J. Electrochem. Soc. 142 457-63 (1995); Errata, J. Electrochem. Soc. 142 L46 (1995).
  • J.A. Medina and D.T. Schwartz, Steady state characterization of the uniform injection cell: I. Theory, J. Electrochem. Soc. 142 451-56 (1995).

1993 [Top]            

  • D.T. Schwartz, Measurements of steady axial streaming at a rotating disc with torsional oscillations, Proc.  R. Soc. Lond. A 442, 397-407 (1993).

1990 [Top]        

  • D.T. Schwartz, T.J. Rehg, P. Stroeve, and B.G. Higgins, Fluctuating flow with mass transfer induced by a  rotating disk electrode with a superimposed time-periodic modulation, Phys. Fluids A 2, 167-77 (1990).

1989 [Top]    

  • D.T. Schwartz, P. Stroeve, and B.G. Higgins, Electrodeposition of composition modulated alloys in a  fluctuating flow, AIChE J. 35, 1315-27 (1989).
  • D.T. Schwartz, Multilayered alloys induced by fluctuating flow, J. Electrochem. Soc. 136, 53C-56C (1989)

1988 [Top]  

  • D.T. Schwartz, Large amplitude HMV, J. Electrochem. Soc. 135, 31C-34C (1988).

1987 [Top]

  • D.T. Schwartz, B.G. Higgins, P. Stroeve, and D. Borowski, Mass transfer studies in a plating cell with a  reciprocating paddle, J. Electrochem. Soc. 134, 1639-45 (1987).

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Daniel T. Schwartz, Director
The Electrochemical Materials and Interfaces LAB
Department of Chemical Engineering
 BOX 351750 University of Washington Seattle, WA 98195
E-mail address: EmiLAB@u.washington.edu
Last updated : 04/05/11