2025 |
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![]() | Nguyen, Vinh; Harding, Anika E.; Yan, Kaito; Peek, Nadya; Cobb, Corie L. Jitterbug: A Hybrid Digital Fabrication Platform for Rapid Prototyping of Printed Electronics Proceedings Article In: ASME 2025 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, ASME, 2025. Abstract | Links | Tags: additive manufacturing, digital fabrication, printed electronics @inproceedings{nguyen_jitterbug_2023,Hybrid digital fabrication combines 3D printing with additional fabrication functionality such as pick-and-place (PnP) to enable customizable, printed electronic (PE) devices with an expansive array of form factors. Researchers have investigated a wide range of new materials, methods, and processes to advance PE devices. However, existing platforms cannot be easily modified or customized, severely limiting one’s ability to adapt hybrid digital fabrication platforms to ever evolving research and prototype needs. This paper introduces Jitterbug, a hybrid digital fabrication platform that supports rapid prototyping of PEs. Jitterbug consists of a toolpath generation workflow and an automatic tool-changing hardware system that builds upon existing open-source 3-axis motion frameworks. The toolpath generation workflow allows users to design PEs and generate toolpath programs directly in its computer-aided design (CAD) environment, provides granular control of the fabrication workflow, and enables printing of conductive traces on substrates with curved features at low-incline angles (< 50°). For demonstration purposes, Jitterbug's initial tool-changing system is designed with the core fused filament fabrication (FFF), direct ink writing (DIW), and PnP tools necessary for hybrid digital fabrication; the system can support up to ten tools for different PE workflows. Jitterbug’s capabilities are demonstrated through fabrication of two functional light-emitting diode (LED) prototype devices, and its implications on designing specialized workflows for PEs are discussed. |
2021 |
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![]() | Bonnassieux, Yvan; Brabec, Christoph J; Cao, Yong; Carmichael, Tricia Breen; Chabinyc, Michael L; Cheng, Kwang-Ting; Cho, Gyoujin; Chung, Anjung; Cobb, Corie L; Distler, Andreas; Egelhaaf, Hans-Joachim; Grau, Gerd; Guo, Xiaojun; Haghiashtiani, Ghazaleh; Huang, Tsung-Ching; Hussain, Muhammad M; Iniguez, Benjamin; Lee, Taik-Min; Li, Ling; Ma, Yuguang; Ma, Dongge; McAlpine, Michael C; Ng, Tse Nga; Österbacka, Ronald; Patel, Shrayesh N; Peng, Junbiao; Peng, Huisheng; Rivnay, Jonathan; Shao, Leilai; Steingart, Daniel; Street, Robert A; Subramanian, Vivek; Torsi, Luisa; Wu, Yunyun The 2021 flexible and printed electronics roadmap Journal Article In: Flexible and Printed Electronics, vol. 6, no. 2, pp. 023001, 2021, ISSN: 2058-8585, (Publisher: IOP Publishing). Abstract | Links | Tags: printed electronics, wearables @article{bonnassieux_2021,This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies. |
2017 |
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![]() | Ng, Tse Nga; Mei, Ping; Cobb, Corie Lynn; Ready, Steven E; Paschkewitz, John S Structural designs for stretchable, conformal electrical interconnects Patent US20170215284A1, 2017. Abstract | Links | Tags: additive manufacturing, printed electronics @patent{ng_structural_2017,Disclosed is a conformable, stretchable and electrical conductive structure, which includes an auxetic structure, and a plurality of electrical conductors. The plurality of electrical conductors being incorporated within the auxetic structure, to form conformable, stretchable electrical interconnects, configured based on a design of the auxetic structure and placement of the electrical conductors incorporated with the auxetic structure. |
![]() | Paschkewitz, John Steven; Cobb, Corie Lynn; Johnson, David Mathew; Iftime, Gabriel; Beck, Victor Alfred; Ng, Tse Nga; Rao, Ranjeet US9543495B2, 2017. Abstract | Links | Tags: additive manufacturing, printed electronics, wearables @patent{paschkewitz_method_2017,A method of forming a flexible thermal regulation device having multiple functional layers. The layers of the device are formed using various manufacturing techniques and are then integrated to form a sheet having multiple devices disposed thereon. The individual devices are then formed from the sheet. |
2016 |
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![]() | Johnson, David Mathew; Cobb, Corie Lynn Flexible thermal regulation device Patent US20160178251A1, 2016. Abstract | Links | Tags: printed electronics, wearables @patent{johnson_flexible_2016,A flexible temperature management device that uses powered thermoelectric elements to transfer thermal energy between a user and the environment to thermally regulate the user. |
2025 |
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![]() | Jitterbug: A Hybrid Digital Fabrication Platform for Rapid Prototyping of Printed Electronics Proceedings Article In: ASME 2025 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, ASME, 2025. |
2021 |
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![]() | The 2021 flexible and printed electronics roadmap Journal Article In: Flexible and Printed Electronics, vol. 6, no. 2, pp. 023001, 2021, ISSN: 2058-8585, (Publisher: IOP Publishing). |
2017 |
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![]() | Structural designs for stretchable, conformal electrical interconnects Patent US20170215284A1, 2017. |
![]() | US9543495B2, 2017. |
2016 |
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![]() | Flexible thermal regulation device Patent US20160178251A1, 2016. |





